The first phone with the Snapdragon 888 chipset was made official yesterday, and the Xiaomi Mi 11 has already fallen into the hands of Chinese bloggers. So Aiao Technology decided to disassemble the phone and show us what it looks like from the inside.
This disassembly, like most others, begins by removing the SIM slot located at the bottom of the device, next to the USB-C port. After that, the back with plastic eco-leather is opened and the screws that hold the cover for the camera sensors are removed. The main 108MP sensor is Samsung's ISOCELL HMX, which comes with IOS support, and is paired with a 5MP Samsung S5K5E9 sensor. There is also a 13MP ultra-wide OmniVision CMOS OV13B10 sensor.
The panel is covered with a large number of copper foils, on the front and the back, and it also has several heat conductors for improved thermal performance. After removing the copper parts, the new Snapdragon 888 chipset is visible, as well as the flash memory. The 4600mAh battery is in charge of Sunwoda Electronics Co. Ltd.